Semiconductor Hazardous Gas Filling Plant Design

Project Synopsis

Project Summary

ION IMPLANT MATERIALS FACILITY PROCESS DESIGN PACKAGE PREPARATION

The client, a world-wide semiconductor materials producer, contracted Process Engineering Associates, LLC (PROCESS) to prepare a complete process design package for a facility that packages hazardous gases for transport and use in the Ion Implant process in the semiconductor industry.

Specific tasks for this project included:

• Generation of a facility design basis that included preparation of process Block Flow charts/diagrams (BFDs) that identified the activities and time needed to complete each work step for all of the production areas within the plant.

• Preparation of Process Flow Diagrams (PFDs) that included material balance information for four (4) gas filling operations representing a total of ten (10) PFDs.

• Preparation of piping and instrumentation diagrams (P&IDs) for all major production areas in the plant.  This involved walking down the fluoride and hydride fill areas as well as the material testing areas to generate as-built drawings.  A total of fifty-two (52) P&IDs were developed for this project.  These P&IDS included all major equipment items, process and utility streams, and primary instruments and controls.

• Preparation of equipment, valve, and instrument lists for all production areas.

• Development of equipment duty specifications for all process equipment, as well as assemble cut sheets and manuals in an organized package to provide an easily accessible packet of equipment information.

• Development of functional controls specifications for each process area.  The control system interface and all alarms and interlocks were captured and presented in a format that provided a template for any future programming duplication or modifications.

• Generation of piping specifications for all the process areas.  Materials of construction, design temperatures and pressures, and fittings were called out for all process lines and utility lines that feed the process areas.  In the case of the hazardous gases, joining methods and quality specifications were also called out to help ensure leak-free piping assemblies.

The process documentation was used as a baseline for design of a new facility in Asia. The project tasks were completed under budget and on schedule.

Industry Type

• Specialty Gas Production
• Semiconductor

Utilized Skills

• Gas filling plant process design
• Hazardous gas handling equipment specification